Demounter HIT-DMS compound Wafer demounter

Demounter HIT-DMS

Demounter HIT-DMS summary

HIT-DMS is demounter to demount under 100um wafer from support substrate.

And demounting process is as follows,

  1. Demount thin wafer from suppor substrate, and bring out one by one.
  2. By sequence control,this machine check demounting point and temperature.

so HIT-DMS achieve automatic demounting.

Demounter HIT-DMS specification

Demounter HIT-DMS specification
Model No. HIT-DMS
Support substrate size under Ø200mm wafer
Plate temperature setting MAX200℃
bject wafer material GaAS,Sapphire,SiC, etc
Mounting/demounting Vacuum clamp slide
Pressure type Vacuum pump
Operation panel LCD touch panel
Operation type equence control
Dimension W1050xD550xH1800mm
Machine weight 800kg
Notes -

*Specifications are subject to change without prior notice

*To use this HIT-DMS, you need air supply.

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