polishing machine HIT-610AT,Full auto(C to C) polishing machine for glass wafer

polishing machine HIT-610AT

polishing machine HIT-610AT summary

polishing machine HIT-610AT

HIT-610AT is full auto(C to C) polishing machine for glass wafer.

HIT-610AT use granite on polishing table, so this table doesn't change surfice level according to frictional heat.

polishing machine HIT-610AT specification

polishing machine HIT-610AT
polishing machine HIT-610AT specification
Model No. HIT-610AT
Plate size Ø610mm,Granite
Plate rotation speed 0-100rpm
shaft for process 1shaft Vacuum clamping
Press type Air sylinder
Maximum Pressure 0-100kg
Process head rotation speed 1-100rpm
Force drive shaft 1shaft
Object size Maximum Ø200mm
Planetary motion stroke +/-50mm
Planetary motion speed 1-30mm/sec
Operation panel LCD touch panel
Control type Sequence control
Dimension W2665xD1210xH1850mm
Machine weight 2500kg
Notes Wet in Wet out type CtoC

*Specifications are subject to change without prior notice

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